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Micron does more than design and manufacture NAND flash memory. We innovate to solve design challenges through better engineering across a spectrum of NAND products — covering everything from mobile to embedded to data center storage applications.

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Faster throughput than other MLC and TLC NAND technologies with up to 100,000 P/E cycle endurance. Compatible with the ONFI synchronous interface.

Twice the density of SLC NAND at a lower cost-per-bit for solid performance and endurance. Compatible with the ONFI synchronous interface.

Higher density in the same space, at a lower cost than SLC or MLC NAND.

QLC will augment TLC to meet the growing demand for read-intensive workloads.

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High performance and high density to accelerate AI across client, data center, mobile, and automotive storage.

First to ship 200+ layer QLC NAND3

For the second time in a row, Micron ships the world’s highest layer count and the densest QLC NAND for OEMs and storage leaders. Micron 232-layer QLC NAND provides an industry-leading I/O performance of 2400 MT/s and helps bring QLC NAND into the mainstream.3

Micron’s leadership 232-layer 3D NAND provides the foundation for a new wave of end-to-end technology innovation.

Micron offers a full range of NAND products to meet the storage needs of a broad array of solutions.

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This SLC NAND cross-reference tool is intended for comparing Micron’s products with other competitor products.

Your single source for tools and resources needed to maximize Micron's products and solutions for your design needs.

1. Competitors are defined as SK hynix, Solidigm, Kioxia, WD and Samsung Semiconductor.

2. Performance and design comparisons are based on information publicly available at the time of announcement.

3. NAND comparisons are based on publicly available information and Micron engineering data available at product launch for currently in production NAND from SK Hynix, Solidigm, Kioxia, WD and Samsung Semiconductor.

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